• Offset-grid contact layout
  • Four contact rows within dielectric connector body
  • 1.905 mm center-to-center contact spacing in each row and 1.905 row-to-row spacing.
  • 0.6 mm nominal pin DIA contact size; 42 to 316 contact positions
  • Dip solder and SMT soldering contact termination types.
  • High contact density, low connector weight, lowmating force. High shock and vibration proof (no micro interruptions – test: 2ns).
  • Conform to ESA specification.

High density signal, PCB connectors, 4 contact rows with flex for space applications conform to ESA specification.